분석용 장비 Store
신규 장비 Store
레이저 디캡 장비(Laser decap)
General type
800 x 600 x 900 mm (L x W x H)
General type + Options
1.493 x 860 x 1.777 mm (L x W x H)
Laser decap의 용도
- EMC(Epoxy Mold Compound) pre-decapsulation
- DIE and PCB Cutting
- Safe, Fast and high quality package decapsulation
- Thick package : DIP, Power FET
- Large package : QFP, TQFP type
- Small package
- Partial decap.
- Cu wire package, Ag wire package
- Laser type : Ytterbium fibre Laser
- Wave length : 1064 nm
- LSM scanning
- Vision camera for decaping area drawing and RTD camera
- Operation and control software : WIN GRAED PRO(Graphical editor running under windows) and WIN Laser
- Fume extractor unit with active carbon filter module and Pre, medium, Hepa filter sets for powders and toxic gas
- Safety Interlock, EMO
- Sample holder and manual stage
