분석용 장비 Store
신규 장비 Store
RIE machine
RIE(Reactive dry etching) 용도
- Etch materials : SiO2, Si3N4, PI, etc
- Uniform etch ( < 5% @ 6” wafer)
- Die to wafer compatible
- Very clean Surface
- Type : RIE, ICP RIE
- Electrode : 150mm ( Optional 200mm)
- RF power : 300W ( Optional 600W)
- Automatching network
- Vacuum and pressure gauge
- 2 CH MFC ( Available to upgrade up to 4 ch)
- Process gases : CF4, O2, SF6, etc
- Vacuum pump : Oil rotary pump(Optional Turbo pump and related stuff)
- PLC based Software(Optional PC Based)
- Recirculating Chiller( 0~80 degree)
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Before etch
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After etch